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IRODALOM |
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3.40. J.F.Friedrich
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Dry Etch.
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4.8. Geis et al
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Enhanc of
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4.17. K. Skidmore :
ECR and MERIE
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4.18. W.Class, M.L. Hill
:
Magnetron
ion etching boots VLSI quality, eliminates problems
Industrial Res.
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Hill :
Magnetron
ion etching boots VLSI quality, eliminates problems
Industrial Res.
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I.J. Pelleetier, Y. Arnal, L. Vallier :
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4.21.
A.Kagatsume, S. Ueda, M Akiba, T. Kawabe :
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4.22. D.
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4.16. J.Ramm,
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4.23. Heung-Sik
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Low-temperature
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4.24.
K. Sakuma, K. Machida, K. Kamoshida, Y. Sato, K. Imai, E. Arai, :
Silicon surface
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4.25. E.J. Petit,
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4.26.
R.D. Rust, D.A. Doane, I. Sawchyn :
Improvements
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Ion beam proc. of optical
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8.2. B.F.Kuvin .:
PAL
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8.3. J.K.Martikainen
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Plasma
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Plasma
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Capac.
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8.10. R.W.Smith et al :
Consolidation
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8.11. Pekshev et al :
Plasma sprayed
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Surf. and Coatings
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8.12. W.X.Pan et al :
Plasma
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8.13. A.Kuehl, H.Riegger :
Keram.
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Werkstoffe
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8.14. H.Hemmes et al :
Supercond
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Prep
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